AMD’s 3D V-Cache chiplet technology will go into production later this year.
AMD surprised everyone at Computex 2021 with a display of their new 3D chiplet technology, which appears to give the kind of performance boost generally associated with a new manufacturing node or microarchitecture.
AMD’s first implementation of 3D chiplet technology, developed in partnership with TSMC, is a vertical cache increase for its high-end CPUs. To summarise, AMD employed a technique known as through-silicon vias (TSVs) to stack extra L3 cache on top of the computational chiplets.
AMD CEO Dr. Lisa Su showed off a prototype Ryzen 5000 CPU with one of two chiplets featuring the added stacked cache. As AnandTech highlights, the difference is obvious compared to the standard chiplet. The 3D V-Cache die is not as large as the core die, so AMD added additional structural silicon for support. Both dies were also thinned, meaning AMD doesn’t have to change up its heatspreader design.
The hybrid bond technique, according to AMD, delivers “over 200 times the interconnect density of 2D chiplets and more than 15 times the density compared to existing 3D packaging solutions.”
AMD demonstrated some of the performance improvements achieved with a normal Ryzen 9 5900X 12-core CPU and one with 3D V-Cache. The base processor has 64MB of total L3 cache (32MB per chiplet), however the 3D V-Cache chip increased this to 192MB. With both CPUs set to 4GHz, the machine with the new chip outperformed the other by an average of 15% at 1080p.
- DOTA2 (Vulkan): +18 percent
- Gears 5 (DX12): +12 percent
- Monster Hunter World (DX11): +25 percent
- League of Legends (DX11): +4 percent
- Fortnite (DX12): +17 percent
AMD said it is on track to begin production of processors with 3D V-Cache chiplets by the end of 2021.